Microwave Design & Characterization of a Novel NanoCu Based UltraFine Pitch ChiptoPackage Interconnect
نویسندگان
چکیده
This paper presents design and characterization of NanoCu based ultra-fine pitch chip-to-package interconnects for microwave frequencies. Transitions are designed with this new interconnect and characterized upto 40 GHz in Packaging configurations such as Chip-on-Chip and Chip-onPackage.
منابع مشابه
Design, implementation, and characterization of a kinematically aligned, cascaded spot- array generator for a modulator-based free-space optical interconnect.
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